3D IC & 2.5D IC Packaging Market Report

Global and Region 3D IC & 2.5D IC Packaging Market Demand & Opportunity Outlook 2022-2028

  • POSTDATE：Aug 01, 2022
  • PAGES：230
  • REPORT CODE：GMM977458
  • REPORT SUMMARY
  • TABLE OF CONTENTS

  • 2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers.

    The report details the trend, potential and market size of 3D IC & 2.5D IC Packaging market, and analyzes the current situation and prospects of the market from both qualitative and quantitative aspects, which can be roughly divided into three parts.

    The first part (Chapter1-7) mainly covers the qualitative analysis of 3D IC & 2.5D IC Packagingmarket, defines the market attractiveness level of 3D IC & 2.5D IC Packaging market through Porter's Five Forces Analysis, and summarizes the different factors in the overall environment through PEST analysis. Understand the distribution of industrial chain value in each link of industrial chain through the analysis of industrial chain structure. Thus estimate the market space of each link.

    The second part (Chapter8-12), based on the segmentation of 3D IC & 2.5D IC Packaging industry, describes the types of 3D IC & 2.5D IC Packaging market, the applications of major players and the market size, and deeply analyzes the current situation of the global 3D IC & 2.5D IC Packaging market and the development prospects and opportunities of 3D IC & 2.5D IC Packaging industry.

    The third part (Chapter14-15) includes the market positions of the major players and information on the market participants, which will help you gain a comprehensive understanding of the current competitive situation and potential growth opportunities in the market.

    As COVID-19 continues to impact the global economy in 2022, the report also considers the short - and long-term impacts of COVID-19 on the global 3D IC & 2.5D IC Packaging market in Chapter 13.

    By Player:

    • Stmicroelectronics

    • ASE Group

    • Broadcom

    • Amkor Technology

    • Advanced Semiconductor Engineering

    • Toshiba Corp

    • Intel Corporation

    • Taiwan Semiconductor Manufacturing

    • Pure Storage

    • Samsung Electronics

    • United Microelectronics

    By Type:

    • 3D TSV

    By End-User:

    • Automotive

    • Consumer electronics

    • Medical devices

    • Military & aerospace

    • Telecommunication

    • Industrial sector and smart technologies

    By Geography:

    • United States

    • Europe

    • China

    • Japan

    • India

    • South Korea

  • TABLE OF CONTENT

    1 Introduction

    • 1.1 Market Definition

    • 1.2 Market Segment Analysis

    • 1.3 Market Size 2022

    • 1.4 3D IC & 2.5D IC Packaging Market Outlook: Forecast for 2022 - 2028

    • 1.5 Pricing Analysis

    2 Executive Summary

    3 3D IC & 2.5D IC Packaging Market Lineage Outlook

    • 3.1 Parent Market Outlook

    • 3.2 Related/Ancillary Market Outlook

    • 3.3 Penetration & Growth Prospect Mapping, 2022

    4 Market Analysis Tools: Porter's Five Forces

    • 4.1 Supplier Power

    • 4.2 Buyer Power

    • 4.3 Substitution Threat

    • 4.4 Threat of New Entrants

    • 4.5 Competitive Rivalry

    5 3D IC & 2.5D IC Packaging Industry Analysis - PEST (Political & Legal, Economic, Social, and Technological)

    • 5.1 Political/Legal Landscape

    • 5.2 Economic Landscape

    • 5.3 Social Landscape

    • 5.4 Technology Landscape

    6 3D IC & 2.5D IC Packaging Market - Value Chain Analysis

    • 6.1 Industry's Value Chain Analysis

    • 6.2 Product Life Cycle

    • 6.3 User Perspective Analysis

    7 Region and Country-wise 3D IC & 2.5D IC Packaging Market Analysis and Outlook to 2022

    • 7.1 Global 3D IC & 2.5D IC Packaging Consumption (2017-2022)

    • 7.2 United States 3D IC & 2.5D IC Packaging Consumption (2017-2022)

    • 7.3 Europe 3D IC & 2.5D IC Packaging Consumption (2017-2022)

    • 7.4 China 3D IC & 2.5D IC Packaging Consumption (2017-2022)

    • 7.5 Japan 3D IC & 2.5D IC Packaging Consumption (2017-2022)

    • 7.6 India 3D IC & 2.5D IC Packaging Consumption (2017-2022)

    • 7.7 South Korea 3D IC & 2.5D IC Packaging Consumption (2017-2022)

    8 Region and Country-wise 3D IC & 2.5D IC Packaging Market Analysis and Outlook to 2028

    • 8.1 Global 3D IC & 2.5D IC Packaging Consumption Forecast (2022-2028)

    • 8.2 United States 3D IC & 2.5D IC Packaging Consumption Forecast (2022-2028)

    • 8.3 Europe 3D IC & 2.5D IC Packaging Consumption Forecast (2022-2028)

    • 8.4 China 3D IC & 2.5D IC Packaging Consumption Forecast (2022-2028)

    • 8.5 Japan 3D IC & 2.5D IC Packaging Consumption Forecast (2022-2028)

    • 8.6 India 3D IC & 2.5D IC Packaging Consumption Forecast (2022-2028)

    • 8.7 South Korea 3D IC & 2.5D IC Packaging Consumption Forecast (2022-2028)

    9 Global 3D IC & 2.5D IC Packaging Market Outlook by Types and Applications to 2022

    • 9.1 Global 3D IC & 2.5D IC Packaging Consumption and Growth Rate by Type (2017-2022)

      • 9.1.1 Global 3D TSV Consumption and Growth Rate (2017-2022)

    • 9.2 Global 3D IC & 2.5D IC Packaging Consumption and Growth Rate by Application (2017-2022)

      • 9.2.1 Global Automotive Consumption and Growth Rate (2017-2022)

      • 9.2.2 Global Consumer electronics Consumption and Growth Rate (2017-2022)

      • 9.2.3 Global Medical devices Consumption and Growth Rate (2017-2022)

      • 9.2.4 Global Military & aerospace Consumption and Growth Rate (2017-2022)

      • 9.2.5 Global Telecommunication Consumption and Growth Rate (2017-2022)

      • 9.2.6 Global Industrial sector and smart technologies Consumption and Growth Rate (2017-2022)

    10 Global 3D IC & 2.5D IC Packaging Market Outlook by Types and Applications to 2028

    • 10.1 Global 3D IC & 2.5D IC Packaging Consumption Forecast and Growth Rate by Type (2022-2028)

      • 10.1.1 Global 3D TSV Consumption Forecast and Growth Rate (2022-2028)

    • 10.2 Global 3D IC & 2.5D IC Packaging Consumption Forecast and Growth Rate by Application (2022-2028)

      • 10.2.1 Global Automotive Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.2 Global Consumer electronics Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.3 Global Medical devices Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.4 Global Military & aerospace Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.5 Global Telecommunication Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.6 Global Industrial sector and smart technologies Consumption Forecast and Growth Rate (2022-2028)

    11 Global 3D IC & 2.5D IC Packaging Import and Export Analysis (Top 5 Countries)

    • 11.1 Global 3D IC & 2.5D IC Packaging Import by Region (Top 5 Countries) (2017-2028)

    • 11.2 Global 3D IC & 2.5D IC Packaging Export by Region (Top 5 Countries) (2017-2028)

    12 Coronavirus Disease (COVID-19) Impact

    • 12.1 Industry Impact Analysis

    • 12.2 3D IC & 2.5D IC Packaging Market Outlook to 2028 - COVID-19 Affected Forecasts

    13 Competition Matrix

    • 13.1 Target Markets

    • 13.2 Comprehensive Analysis of Products in Competitive Markets

    14 Global 3D IC & 2.5D IC Packaging Market Competitive Analysis

    • 14.1 Stmicroelectronics

      • 14.1.1 Stmicroelectronics Company Details

      • 14.1.2 Stmicroelectronics 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

      • 14.1.3 Stmicroelectronics 3D IC & 2.5D IC Packaging Product and Service

    • 14.2 ASE Group

      • 14.2.1 ASE Group Company Details

      • 14.2.2 ASE Group 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

      • 14.2.3 ASE Group 3D IC & 2.5D IC Packaging Product and Service

    • 14.3 Broadcom

      • 14.3.1 Broadcom Company Details

      • 14.3.2 Broadcom 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

      • 14.3.3 Broadcom 3D IC & 2.5D IC Packaging Product and Service

    • 14.4 Amkor Technology

      • 14.4.1 Amkor Technology Company Details

      • 14.4.2 Amkor Technology 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

      • 14.4.3 Amkor Technology 3D IC & 2.5D IC Packaging Product and Service

    • 14.5 Advanced Semiconductor Engineering

      • 14.5.1 Advanced Semiconductor Engineering Company Details

      • 14.5.2 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

      • 14.5.3 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product and Service

    • 14.6 Toshiba Corp

      • 14.6.1 Toshiba Corp Company Details

      • 14.6.2 Toshiba Corp 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

      • 14.6.3 Toshiba Corp 3D IC & 2.5D IC Packaging Product and Service

    • 14.7 Intel Corporation

      • 14.7.1 Intel Corporation Company Details

      • 14.7.2 Intel Corporation 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

      • 14.7.3 Intel Corporation 3D IC & 2.5D IC Packaging Product and Service

    • 14.8 Taiwan Semiconductor Manufacturing

      • 14.8.1 Taiwan Semiconductor Manufacturing Company Details

      • 14.8.2 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

      • 14.8.3 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product and Service

    • 14.9 Pure Storage

      • 14.9.1 Pure Storage Company Details

      • 14.9.2 Pure Storage 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

      • 14.9.3 Pure Storage 3D IC & 2.5D IC Packaging Product and Service

    • 14.10 Samsung Electronics

      • 14.10.1 Samsung Electronics Company Details

      • 14.10.2 Samsung Electronics 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

      • 14.10.3 Samsung Electronics 3D IC & 2.5D IC Packaging Product and Service

    • 14.11 United Microelectronics

      • 14.11.1 United Microelectronics Company Details

      • 14.11.2 United Microelectronics 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

      • 14.11.3 United Microelectronics 3D IC & 2.5D IC Packaging Product and Service

    15 Appendix


    TABLE OF CHARTS

    • Table Definition of 3D IC & 2.5D IC Packaging

    • Figure 3D IC & 2.5D IC Packaging Picture

    • Table Global 3D IC & 2.5D IC Packaging Market Size and Forecast 2022 - 2028 (USD million)

    • Figure Global 3D IC & 2.5D IC Packaging Market Size and Forecast 2022 - 2028 (USD million)

    • Figure Global 3D IC & 2.5D IC Packaging Market: Year-over-year Growth 2022 - 2028 (%)

    • Table Parent Market Analysis

    • Figure Parent Market Price

    • Table Related/Ancillary Market Outlook Analysis

    • Table Supplier Power Analysis

    • Table Buyer Power Analysis

    • Table Substitution Threat Analysis

    • Table Threat of New Entrants Analysis

    • Table Competitive Rivalry Analysis

    • Figure Global 3D IC & 2.5D IC Packaging Consumption by Country (2017-2022)

    • Figure United States 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2017-2022)

    • Table Europe 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2017-2022)

    • Figure China 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2017-2022)

    • Figure Japan 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2017-2022)

    • Figure India 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2017-2022)

    • Figure South Korea 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2017-2022)

    • Figure Global 3D IC & 2.5D IC Packaging Consumption Forecast by Country (2022-2028)

    • Figure United States 3D IC & 2.5D IC Packaging Consumption Forecast and Growth Rate (2022-2028)

    • Table Europe 3D IC & 2.5D IC Packaging Consumption Forecast and Growth Rate (2022-2028)

    • Figure China 3D IC & 2.5D IC Packaging Consumption Forecast and Growth Rate (2022-2028)

    • Figure Japan 3D IC & 2.5D IC Packaging Consumption Forecast and Growth Rate (2022-2028)

    • Figure India 3D IC & 2.5D IC Packaging Consumption Forecast and Growth Rate (2022-2028)

    • Figure South Korea 3D IC & 2.5D IC Packaging Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global 3D TSV Consumption and Growth Rate (2017-2022)

    • Figure Global Automotive Consumption and Growth Rate (2017-2022)

    • Figure Global Consumer electronics Consumption and Growth Rate (2017-2022)

    • Figure Global Medical devices Consumption and Growth Rate (2017-2022)

    • Figure Global Military & aerospace Consumption and Growth Rate (2017-2022)

    • Figure Global Telecommunication Consumption and Growth Rate (2017-2022)

    • Figure Global Industrial sector and smart technologies Consumption and Growth Rate (2017-2022)

    • Figure Global 3D TSV Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Automotive Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Consumer electronics Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Medical devices Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Military & aerospace Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Telecommunication Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Industrial sector and smart technologies Consumption Forecast and Growth Rate (2022-2028)

    • Table Global 3D IC & 2.5D IC Packaging Import by Region (Top 5 Countries) (2017-2028)

    • Table Global 3D IC & 2.5D IC Packaging Export by Region (Top 5 Countries) (2017-2028)

    • Table Stmicroelectronics (Foundation Year, Company Profile and etc.)

    • Table Stmicroelectronics 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

    • Table Stmicroelectronics 3D IC & 2.5D IC Packaging Product and Service

    • Table ASE Group (Foundation Year, Company Profile and etc.)

    • Table ASE Group 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

    • Table ASE Group 3D IC & 2.5D IC Packaging Product and Service

    • Table Broadcom (Foundation Year, Company Profile and etc.)

    • Table Broadcom 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

    • Table Broadcom 3D IC & 2.5D IC Packaging Product and Service

    • Table Amkor Technology (Foundation Year, Company Profile and etc.)

    • Table Amkor Technology 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

    • Table Amkor Technology 3D IC & 2.5D IC Packaging Product and Service

    • Table Advanced Semiconductor Engineering (Foundation Year, Company Profile and etc.)

    • Table Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

    • Table Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product and Service

    • Table Toshiba Corp (Foundation Year, Company Profile and etc.)

    • Table Toshiba Corp 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

    • Table Toshiba Corp 3D IC & 2.5D IC Packaging Product and Service

    • Table Intel Corporation (Foundation Year, Company Profile and etc.)

    • Table Intel Corporation 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

    • Table Intel Corporation 3D IC & 2.5D IC Packaging Product and Service

    • Table Taiwan Semiconductor Manufacturing (Foundation Year, Company Profile and etc.)

    • Table Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

    • Table Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product and Service

    • Table Pure Storage (Foundation Year, Company Profile and etc.)

    • Table Pure Storage 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

    • Table Pure Storage 3D IC & 2.5D IC Packaging Product and Service

    • Table Samsung Electronics (Foundation Year, Company Profile and etc.)

    • Table Samsung Electronics 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

    • Table Samsung Electronics 3D IC & 2.5D IC Packaging Product and Service

    • Table United Microelectronics (Foundation Year, Company Profile and etc.)

    • Table United Microelectronics 3D IC & 2.5D IC Packaging Sales, Price, Value and Gross Profit (2017-2022)

    • Table United Microelectronics 3D IC & 2.5D IC Packaging Product and Service


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