3D IC and 2.5D IC Market Report

Global and Region 3D IC and 2.5D IC Market Demand & Opportunity Outlook 2022-2028

  • POSTDATE：Aug 01, 2022
  • PAGES：184
  • REPORT CODE：GMM965637
  • REPORT SUMMARY
  • TABLE OF CONTENTS

  • The report details the trend, potential and market size of 3D IC and 2.5D IC market, and analyzes the current situation and prospects of the market from both qualitative and quantitative aspects, which can be roughly divided into three parts.

    The first part (Chapter1-7) mainly covers the qualitative analysis of 3D IC and 2.5D ICmarket, defines the market attractiveness level of 3D IC and 2.5D IC market through Porter's Five Forces Analysis, and summarizes the different factors in the overall environment through PEST analysis. Understand the distribution of industrial chain value in each link of industrial chain through the analysis of industrial chain structure. Thus estimate the market space of each link.

    The second part (Chapter8-12), based on the segmentation of 3D IC and 2.5D IC industry, describes the types of 3D IC and 2.5D IC market, the applications of major players and the market size, and deeply analyzes the current situation of the global 3D IC and 2.5D IC market and the development prospects and opportunities of 3D IC and 2.5D IC industry.

    The third part (Chapter14-15) includes the market positions of the major players and information on the market participants, which will help you gain a comprehensive understanding of the current competitive situation and potential growth opportunities in the market.

    As COVID-19 continues to impact the global economy in 2022, the report also considers the short - and long-term impacts of COVID-19 on the global 3D IC and 2.5D IC market in Chapter 13.

    By Player:

    • Toshiba (Japan)(Taiwan)

    • Intel (US)

    • Stmicroelectronics (Switzerland)

    • Broadcom (US)(Taiwan)

    • ASE Group

    • Jiangsu Changjiang Electronics (China)(Taiwan)

    • Amkor (US)

    • Samsung (South Korea)

    • TSMC

    • UMC

    By Type:

    • 3D Wafer-level Chip-scale Packaging

    • 3D TSV

    • 25D

    By End-User:

    • Consumer Electronics

    • Telecommunication

    • Industry Sector

    • Automotive

    • Military and Aerospace

    • Smart Technologies

    • Medical Devices

    By Geography:

    • United States

    • Europe

    • China

    • Japan

    • India

    • South Korea

  • TABLE OF CONTENT

    1 Introduction

    • 1.1 Market Definition

    • 1.2 Market Segment Analysis

    • 1.3 Market Size 2022

    • 1.4 3D IC and 2.5D IC Market Outlook: Forecast for 2022 - 2028

    • 1.5 Pricing Analysis

    2 Executive Summary

    3 3D IC and 2.5D IC Market Lineage Outlook

    • 3.1 Parent Market Outlook

    • 3.2 Related/Ancillary Market Outlook

    • 3.3 Penetration & Growth Prospect Mapping, 2022

    4 Market Analysis Tools: Porter's Five Forces

    • 4.1 Supplier Power

    • 4.2 Buyer Power

    • 4.3 Substitution Threat

    • 4.4 Threat of New Entrants

    • 4.5 Competitive Rivalry

    5 3D IC and 2.5D IC Industry Analysis - PEST (Political & Legal, Economic, Social, and Technological)

    • 5.1 Political/Legal Landscape

    • 5.2 Economic Landscape

    • 5.3 Social Landscape

    • 5.4 Technology Landscape

    6 3D IC and 2.5D IC Market - Value Chain Analysis

    • 6.1 Industry's Value Chain Analysis

    • 6.2 Product Life Cycle

    • 6.3 User Perspective Analysis

    7 Region and Country-wise 3D IC and 2.5D IC Market Analysis and Outlook to 2022

    • 7.1 Global 3D IC and 2.5D IC Consumption (2017-2022)

    • 7.2 United States 3D IC and 2.5D IC Consumption (2017-2022)

    • 7.3 Europe 3D IC and 2.5D IC Consumption (2017-2022)

    • 7.4 China 3D IC and 2.5D IC Consumption (2017-2022)

    • 7.5 Japan 3D IC and 2.5D IC Consumption (2017-2022)

    • 7.6 India 3D IC and 2.5D IC Consumption (2017-2022)

    • 7.7 South Korea 3D IC and 2.5D IC Consumption (2017-2022)

    8 Region and Country-wise 3D IC and 2.5D IC Market Analysis and Outlook to 2028

    • 8.1 Global 3D IC and 2.5D IC Consumption Forecast (2022-2028)

    • 8.2 United States 3D IC and 2.5D IC Consumption Forecast (2022-2028)

    • 8.3 Europe 3D IC and 2.5D IC Consumption Forecast (2022-2028)

    • 8.4 China 3D IC and 2.5D IC Consumption Forecast (2022-2028)

    • 8.5 Japan 3D IC and 2.5D IC Consumption Forecast (2022-2028)

    • 8.6 India 3D IC and 2.5D IC Consumption Forecast (2022-2028)

    • 8.7 South Korea 3D IC and 2.5D IC Consumption Forecast (2022-2028)

    9 Global 3D IC and 2.5D IC Market Outlook by Types and Applications to 2022

    • 9.1 Global 3D IC and 2.5D IC Consumption and Growth Rate by Type (2017-2022)

      • 9.1.1 Global 3D Wafer-level Chip-scale Packaging Consumption and Growth Rate (2017-2022)

      • 9.1.2 Global 3D TSV Consumption and Growth Rate (2017-2022)

      • 9.1.3 Global 25D Consumption and Growth Rate (2017-2022)

    • 9.2 Global 3D IC and 2.5D IC Consumption and Growth Rate by Application (2017-2022)

      • 9.2.1 Global Consumer Electronics Consumption and Growth Rate (2017-2022)

      • 9.2.2 Global Telecommunication Consumption and Growth Rate (2017-2022)

      • 9.2.3 Global Industry Sector Consumption and Growth Rate (2017-2022)

      • 9.2.4 Global Automotive Consumption and Growth Rate (2017-2022)

      • 9.2.5 Global Military and Aerospace Consumption and Growth Rate (2017-2022)

      • 9.2.6 Global Smart Technologies Consumption and Growth Rate (2017-2022)

      • 9.2.7 Global Medical Devices Consumption and Growth Rate (2017-2022)

    10 Global 3D IC and 2.5D IC Market Outlook by Types and Applications to 2028

    • 10.1 Global 3D IC and 2.5D IC Consumption Forecast and Growth Rate by Type (2022-2028)

      • 10.1.1 Global 3D Wafer-level Chip-scale Packaging Consumption Forecast and Growth Rate (2022-2028)

      • 10.1.2 Global 3D TSV Consumption Forecast and Growth Rate (2022-2028)

      • 10.1.3 Global 25D Consumption Forecast and Growth Rate (2022-2028)

    • 10.2 Global 3D IC and 2.5D IC Consumption Forecast and Growth Rate by Application (2022-2028)

      • 10.2.1 Global Consumer Electronics Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.2 Global Telecommunication Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.3 Global Industry Sector Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.4 Global Automotive Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.5 Global Military and Aerospace Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.6 Global Smart Technologies Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.7 Global Medical Devices Consumption Forecast and Growth Rate (2022-2028)

    11 Global 3D IC and 2.5D IC Import and Export Analysis (Top 5 Countries)

    • 11.1 Global 3D IC and 2.5D IC Import by Region (Top 5 Countries) (2017-2028)

    • 11.2 Global 3D IC and 2.5D IC Export by Region (Top 5 Countries) (2017-2028)

    12 Coronavirus Disease (COVID-19) Impact

    • 12.1 Industry Impact Analysis

    • 12.2 3D IC and 2.5D IC Market Outlook to 2028 - COVID-19 Affected Forecasts

    13 Competition Matrix

    • 13.1 Target Markets

    • 13.2 Comprehensive Analysis of Products in Competitive Markets

    14 Global 3D IC and 2.5D IC Market Competitive Analysis

    • 14.1 Toshiba (Japan)(Taiwan)

      • 14.1.1 Toshiba (Japan)(Taiwan) Company Details

      • 14.1.2 Toshiba (Japan)(Taiwan) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

      • 14.1.3 Toshiba (Japan)(Taiwan) 3D IC and 2.5D IC Product and Service

    • 14.2 Intel (US)

      • 14.2.1 Intel (US) Company Details

      • 14.2.2 Intel (US) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

      • 14.2.3 Intel (US) 3D IC and 2.5D IC Product and Service

    • 14.3 Stmicroelectronics (Switzerland)

      • 14.3.1 Stmicroelectronics (Switzerland) Company Details

      • 14.3.2 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

      • 14.3.3 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Product and Service

    • 14.4 Broadcom (US)(Taiwan)

      • 14.4.1 Broadcom (US)(Taiwan) Company Details

      • 14.4.2 Broadcom (US)(Taiwan) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

      • 14.4.3 Broadcom (US)(Taiwan) 3D IC and 2.5D IC Product and Service

    • 14.5 ASE Group

      • 14.5.1 ASE Group Company Details

      • 14.5.2 ASE Group 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

      • 14.5.3 ASE Group 3D IC and 2.5D IC Product and Service

    • 14.6 Jiangsu Changjiang Electronics (China)(Taiwan)

      • 14.6.1 Jiangsu Changjiang Electronics (China)(Taiwan) Company Details

      • 14.6.2 Jiangsu Changjiang Electronics (China)(Taiwan) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

      • 14.6.3 Jiangsu Changjiang Electronics (China)(Taiwan) 3D IC and 2.5D IC Product and Service

    • 14.7 Amkor (US)

      • 14.7.1 Amkor (US) Company Details

      • 14.7.2 Amkor (US) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

      • 14.7.3 Amkor (US) 3D IC and 2.5D IC Product and Service

    • 14.8 Samsung (South Korea)

      • 14.8.1 Samsung (South Korea) Company Details

      • 14.8.2 Samsung (South Korea) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

      • 14.8.3 Samsung (South Korea) 3D IC and 2.5D IC Product and Service

    • 14.9 TSMC

      • 14.9.1 TSMC Company Details

      • 14.9.2 TSMC 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

      • 14.9.3 TSMC 3D IC and 2.5D IC Product and Service

    • 14.10 UMC

      • 14.10.1 UMC Company Details

      • 14.10.2 UMC 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

      • 14.10.3 UMC 3D IC and 2.5D IC Product and Service

    15 Appendix


    TABLE OF CHARTS

    • Table Definition of 3D IC and 2.5D IC

    • Figure 3D IC and 2.5D IC Picture

    • Table Global 3D IC and 2.5D IC Market Size and Forecast 2022 - 2028 (USD million)

    • Figure Global 3D IC and 2.5D IC Market Size and Forecast 2022 - 2028 (USD million)

    • Figure Global 3D IC and 2.5D IC Market: Year-over-year Growth 2022 - 2028 (%)

    • Table Parent Market Analysis

    • Figure Parent Market Price

    • Table Related/Ancillary Market Outlook Analysis

    • Table Supplier Power Analysis

    • Table Buyer Power Analysis

    • Table Substitution Threat Analysis

    • Table Threat of New Entrants Analysis

    • Table Competitive Rivalry Analysis

    • Figure Global 3D IC and 2.5D IC Consumption by Country (2017-2022)

    • Figure United States 3D IC and 2.5D IC Consumption and Growth Rate (2017-2022)

    • Table Europe 3D IC and 2.5D IC Consumption and Growth Rate (2017-2022)

    • Figure China 3D IC and 2.5D IC Consumption and Growth Rate (2017-2022)

    • Figure Japan 3D IC and 2.5D IC Consumption and Growth Rate (2017-2022)

    • Figure India 3D IC and 2.5D IC Consumption and Growth Rate (2017-2022)

    • Figure South Korea 3D IC and 2.5D IC Consumption and Growth Rate (2017-2022)

    • Figure Global 3D IC and 2.5D IC Consumption Forecast by Country (2022-2028)

    • Figure United States 3D IC and 2.5D IC Consumption Forecast and Growth Rate (2022-2028)

    • Table Europe 3D IC and 2.5D IC Consumption Forecast and Growth Rate (2022-2028)

    • Figure China 3D IC and 2.5D IC Consumption Forecast and Growth Rate (2022-2028)

    • Figure Japan 3D IC and 2.5D IC Consumption Forecast and Growth Rate (2022-2028)

    • Figure India 3D IC and 2.5D IC Consumption Forecast and Growth Rate (2022-2028)

    • Figure South Korea 3D IC and 2.5D IC Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global 3D Wafer-level Chip-scale Packaging Consumption and Growth Rate (2017-2022)

    • Figure Global 3D TSV Consumption and Growth Rate (2017-2022)

    • Figure Global 25D Consumption and Growth Rate (2017-2022)

    • Figure Global Consumer Electronics Consumption and Growth Rate (2017-2022)

    • Figure Global Telecommunication Consumption and Growth Rate (2017-2022)

    • Figure Global Industry Sector Consumption and Growth Rate (2017-2022)

    • Figure Global Automotive Consumption and Growth Rate (2017-2022)

    • Figure Global Military and Aerospace Consumption and Growth Rate (2017-2022)

    • Figure Global Smart Technologies Consumption and Growth Rate (2017-2022)

    • Figure Global Medical Devices Consumption and Growth Rate (2017-2022)

    • Figure Global 3D Wafer-level Chip-scale Packaging Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global 3D TSV Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global 25D Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Consumer Electronics Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Telecommunication Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Industry Sector Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Automotive Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Military and Aerospace Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Smart Technologies Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Medical Devices Consumption Forecast and Growth Rate (2022-2028)

    • Table Global 3D IC and 2.5D IC Import by Region (Top 5 Countries) (2017-2028)

    • Table Global 3D IC and 2.5D IC Export by Region (Top 5 Countries) (2017-2028)

    • Table Toshiba (Japan)(Taiwan) (Foundation Year, Company Profile and etc.)

    • Table Toshiba (Japan)(Taiwan) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

    • Table Toshiba (Japan)(Taiwan) 3D IC and 2.5D IC Product and Service

    • Table Intel (US) (Foundation Year, Company Profile and etc.)

    • Table Intel (US) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

    • Table Intel (US) 3D IC and 2.5D IC Product and Service

    • Table Stmicroelectronics (Switzerland) (Foundation Year, Company Profile and etc.)

    • Table Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

    • Table Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Product and Service

    • Table Broadcom (US)(Taiwan) (Foundation Year, Company Profile and etc.)

    • Table Broadcom (US)(Taiwan) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

    • Table Broadcom (US)(Taiwan) 3D IC and 2.5D IC Product and Service

    • Table ASE Group (Foundation Year, Company Profile and etc.)

    • Table ASE Group 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

    • Table ASE Group 3D IC and 2.5D IC Product and Service

    • Table Jiangsu Changjiang Electronics (China)(Taiwan) (Foundation Year, Company Profile and etc.)

    • Table Jiangsu Changjiang Electronics (China)(Taiwan) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

    • Table Jiangsu Changjiang Electronics (China)(Taiwan) 3D IC and 2.5D IC Product and Service

    • Table Amkor (US) (Foundation Year, Company Profile and etc.)

    • Table Amkor (US) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

    • Table Amkor (US) 3D IC and 2.5D IC Product and Service

    • Table Samsung (South Korea) (Foundation Year, Company Profile and etc.)

    • Table Samsung (South Korea) 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

    • Table Samsung (South Korea) 3D IC and 2.5D IC Product and Service

    • Table TSMC (Foundation Year, Company Profile and etc.)

    • Table TSMC 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

    • Table TSMC 3D IC and 2.5D IC Product and Service

    • Table UMC (Foundation Year, Company Profile and etc.)

    • Table UMC 3D IC and 2.5D IC Sales, Price, Value and Gross Profit (2017-2022)

    • Table UMC 3D IC and 2.5D IC Product and Service


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