Global and Region Wafer-level Packaging Equipment Market Demand & Opportunity Outlook 2022-2028

  • REPORT SUMMARY
  • TABLE OF CONTENTS
  • Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.

    In the recent years, wafer-level packaging equipment production value showed a trend of steady growth. At present, the major manufacturers of wafer-level packaging equipment are concentrated in North America, EU, and Japan. Applied Materials is the world's largest wafer-level packaging equipment producer.Wafer-level packaging equipment is very expensive, usually it does not go through the distributor and provided by the manufacturer directly to the customer.

    The report details the trend, potential and market size of Wafer-level Packaging Equipment market, and analyzes the current situation and prospects of the market from both qualitative and quantitative aspects, which can be roughly divided into three parts.

    The first part (Chapter1-7) mainly covers the qualitative analysis of Wafer-level Packaging Equipmentmarket, defines the market attractiveness level of Wafer-level Packaging Equipment market through Porter's Five Forces Analysis, and summarizes the different factors in the overall environment through PEST analysis. Understand the distribution of industrial chain value in each link of industrial chain through the analysis of industrial chain structure. Thus estimate the market space of each link.

    The second part (Chapter8-12), based on the segmentation of Wafer-level Packaging Equipment industry, describes the types of Wafer-level Packaging Equipment market, the applications of major players and the market size, and deeply analyzes the current situation of the global Wafer-level Packaging Equipment market and the development prospects and opportunities of Wafer-level Packaging Equipment industry.

    The third part (Chapter14-15) includes the market positions of the major players and information on the market participants, which will help you gain a comprehensive understanding of the current competitive situation and potential growth opportunities in the market.

    As COVID-19 continues to impact the global economy in 2022, the report also considers the short - and long-term impacts of COVID-19 on the global Wafer-level Packaging Equipment market in Chapter 13.

    By Player:

    • Applied Materials

    • Tokyo Electron

    • KLA-Tencor Corporation

    • EV Group

    • Tokyo Seimitsu

    • Disco

    • SEMES

    • Suss Microtec

    • Ultratech

    • Rudolph Technologies

    By Type:

    • Fan In

    • Fan Out

    By End-User:

    • Integrated Circuit Fabrication Process

    • Semiconductor Industry

    • Microelectromechanical Systems (MEMS)

    • Other

    By Geography:

    • United States

    • Europe

    • China

    • Japan

    • India

    • South Korea

  • TABLE OF CONTENT

    1 Introduction

    • 1.1 Market Definition

    • 1.2 Market Segment Analysis

    • 1.3 Market Size 2022

    • 1.4 Wafer-level Packaging Equipment Market Outlook: Forecast for 2022 - 2028

    • 1.5 Pricing Analysis

    2 Executive Summary

    3 Wafer-level Packaging Equipment Market Lineage Outlook

    • 3.1 Parent Market Outlook

    • 3.2 Related/Ancillary Market Outlook

    • 3.3 Penetration & Growth Prospect Mapping, 2022

    4 Market Analysis Tools: Porter's Five Forces

    • 4.1 Supplier Power

    • 4.2 Buyer Power

    • 4.3 Substitution Threat

    • 4.4 Threat of New Entrants

    • 4.5 Competitive Rivalry

    5 Wafer-level Packaging Equipment Industry Analysis - PEST (Political & Legal, Economic, Social, and Technological)

    • 5.1 Political/Legal Landscape

    • 5.2 Economic Landscape

    • 5.3 Social Landscape

    • 5.4 Technology Landscape

    6 Wafer-level Packaging Equipment Market - Value Chain Analysis

    • 6.1 Industry's Value Chain Analysis

    • 6.2 Product Life Cycle

    • 6.3 User Perspective Analysis

    7 Region and Country-wise Wafer-level Packaging Equipment Market Analysis and Outlook to 2022

    • 7.1 Global Wafer-level Packaging Equipment Consumption (2017-2022)

    • 7.2 United States Wafer-level Packaging Equipment Consumption (2017-2022)

    • 7.3 Europe Wafer-level Packaging Equipment Consumption (2017-2022)

    • 7.4 China Wafer-level Packaging Equipment Consumption (2017-2022)

    • 7.5 Japan Wafer-level Packaging Equipment Consumption (2017-2022)

    • 7.6 India Wafer-level Packaging Equipment Consumption (2017-2022)

    • 7.7 South Korea Wafer-level Packaging Equipment Consumption (2017-2022)

    8 Region and Country-wise Wafer-level Packaging Equipment Market Analysis and Outlook to 2028

    • 8.1 Global Wafer-level Packaging Equipment Consumption Forecast (2022-2028)

    • 8.2 United States Wafer-level Packaging Equipment Consumption Forecast (2022-2028)

    • 8.3 Europe Wafer-level Packaging Equipment Consumption Forecast (2022-2028)

    • 8.4 China Wafer-level Packaging Equipment Consumption Forecast (2022-2028)

    • 8.5 Japan Wafer-level Packaging Equipment Consumption Forecast (2022-2028)

    • 8.6 India Wafer-level Packaging Equipment Consumption Forecast (2022-2028)

    • 8.7 South Korea Wafer-level Packaging Equipment Consumption Forecast (2022-2028)

    9 Global Wafer-level Packaging Equipment Market Outlook by Types and Applications to 2022

    • 9.1 Global Wafer-level Packaging Equipment Consumption and Growth Rate by Type (2017-2022)

      • 9.1.1 Global Fan In Consumption and Growth Rate (2017-2022)

      • 9.1.2 Global Fan Out Consumption and Growth Rate (2017-2022)

    • 9.2 Global Wafer-level Packaging Equipment Consumption and Growth Rate by Application (2017-2022)

      • 9.2.1 Global Integrated Circuit Fabrication Process Consumption and Growth Rate (2017-2022)

      • 9.2.2 Global Semiconductor Industry Consumption and Growth Rate (2017-2022)

      • 9.2.3 Global Microelectromechanical Systems (MEMS) Consumption and Growth Rate (2017-2022)

      • 9.2.4 Global Other Consumption and Growth Rate (2017-2022)

    10 Global Wafer-level Packaging Equipment Market Outlook by Types and Applications to 2028

    • 10.1 Global Wafer-level Packaging Equipment Consumption Forecast and Growth Rate by Type (2022-2028)

      • 10.1.1 Global Fan In Consumption Forecast and Growth Rate (2022-2028)

      • 10.1.2 Global Fan Out Consumption Forecast and Growth Rate (2022-2028)

    • 10.2 Global Wafer-level Packaging Equipment Consumption Forecast and Growth Rate by Application (2022-2028)

      • 10.2.1 Global Integrated Circuit Fabrication Process Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.2 Global Semiconductor Industry Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.3 Global Microelectromechanical Systems (MEMS) Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.4 Global Other Consumption Forecast and Growth Rate (2022-2028)

    11 Global Wafer-level Packaging Equipment Import and Export Analysis (Top 5 Countries)

    • 11.1 Global Wafer-level Packaging Equipment Import by Region (Top 5 Countries) (2017-2028)

    • 11.2 Global Wafer-level Packaging Equipment Export by Region (Top 5 Countries) (2017-2028)

    12 Coronavirus Disease (COVID-19) Impact

    • 12.1 Industry Impact Analysis

    • 12.2 Wafer-level Packaging Equipment Market Outlook to 2028 - COVID-19 Affected Forecasts

    13 Competition Matrix

    • 13.1 Target Markets

    • 13.2 Comprehensive Analysis of Products in Competitive Markets

    14 Global Wafer-level Packaging Equipment Market Competitive Analysis

    • 14.1 Applied Materials

      • 14.1.1 Applied Materials Company Details

      • 14.1.2 Applied Materials Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

      • 14.1.3 Applied Materials Wafer-level Packaging Equipment Product and Service

    • 14.2 Tokyo Electron

      • 14.2.1 Tokyo Electron Company Details

      • 14.2.2 Tokyo Electron Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

      • 14.2.3 Tokyo Electron Wafer-level Packaging Equipment Product and Service

    • 14.3 KLA-Tencor Corporation

      • 14.3.1 KLA-Tencor Corporation Company Details

      • 14.3.2 KLA-Tencor Corporation Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

      • 14.3.3 KLA-Tencor Corporation Wafer-level Packaging Equipment Product and Service

    • 14.4 EV Group

      • 14.4.1 EV Group Company Details

      • 14.4.2 EV Group Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

      • 14.4.3 EV Group Wafer-level Packaging Equipment Product and Service

    • 14.5 Tokyo Seimitsu

      • 14.5.1 Tokyo Seimitsu Company Details

      • 14.5.2 Tokyo Seimitsu Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

      • 14.5.3 Tokyo Seimitsu Wafer-level Packaging Equipment Product and Service

    • 14.6 Disco

      • 14.6.1 Disco Company Details

      • 14.6.2 Disco Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

      • 14.6.3 Disco Wafer-level Packaging Equipment Product and Service

    • 14.7 SEMES

      • 14.7.1 SEMES Company Details

      • 14.7.2 SEMES Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

      • 14.7.3 SEMES Wafer-level Packaging Equipment Product and Service

    • 14.8 Suss Microtec

      • 14.8.1 Suss Microtec Company Details

      • 14.8.2 Suss Microtec Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

      • 14.8.3 Suss Microtec Wafer-level Packaging Equipment Product and Service

    • 14.9 Ultratech

      • 14.9.1 Ultratech Company Details

      • 14.9.2 Ultratech Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

      • 14.9.3 Ultratech Wafer-level Packaging Equipment Product and Service

    • 14.10 Rudolph Technologies

      • 14.10.1 Rudolph Technologies Company Details

      • 14.10.2 Rudolph Technologies Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

      • 14.10.3 Rudolph Technologies Wafer-level Packaging Equipment Product and Service

    15 Appendix


    TABLE OF CHARTS

    • Table Definition of Wafer-level Packaging Equipment

    • Figure Wafer-level Packaging Equipment Picture

    • Table Global Wafer-level Packaging Equipment Market Size and Forecast 2022 - 2028 (USD million)

    • Figure Global Wafer-level Packaging Equipment Market Size and Forecast 2022 - 2028 (USD million)

    • Figure Global Wafer-level Packaging Equipment Market: Year-over-year Growth 2022 - 2028 (%)

    • Table Parent Market Analysis

    • Figure Parent Market Price

    • Table Related/Ancillary Market Outlook Analysis

    • Table Supplier Power Analysis

    • Table Buyer Power Analysis

    • Table Substitution Threat Analysis

    • Table Threat of New Entrants Analysis

    • Table Competitive Rivalry Analysis

    • Figure Global Wafer-level Packaging Equipment Consumption by Country (2017-2022)

    • Figure United States Wafer-level Packaging Equipment Consumption and Growth Rate (2017-2022)

    • Table Europe Wafer-level Packaging Equipment Consumption and Growth Rate (2017-2022)

    • Figure China Wafer-level Packaging Equipment Consumption and Growth Rate (2017-2022)

    • Figure Japan Wafer-level Packaging Equipment Consumption and Growth Rate (2017-2022)

    • Figure India Wafer-level Packaging Equipment Consumption and Growth Rate (2017-2022)

    • Figure South Korea Wafer-level Packaging Equipment Consumption and Growth Rate (2017-2022)

    • Figure Global Wafer-level Packaging Equipment Consumption Forecast by Country (2022-2028)

    • Figure United States Wafer-level Packaging Equipment Consumption Forecast and Growth Rate (2022-2028)

    • Table Europe Wafer-level Packaging Equipment Consumption Forecast and Growth Rate (2022-2028)

    • Figure China Wafer-level Packaging Equipment Consumption Forecast and Growth Rate (2022-2028)

    • Figure Japan Wafer-level Packaging Equipment Consumption Forecast and Growth Rate (2022-2028)

    • Figure India Wafer-level Packaging Equipment Consumption Forecast and Growth Rate (2022-2028)

    • Figure South Korea Wafer-level Packaging Equipment Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Fan In Consumption and Growth Rate (2017-2022)

    • Figure Global Fan Out Consumption and Growth Rate (2017-2022)

    • Figure Global Integrated Circuit Fabrication Process Consumption and Growth Rate (2017-2022)

    • Figure Global Semiconductor Industry Consumption and Growth Rate (2017-2022)

    • Figure Global Microelectromechanical Systems (MEMS) Consumption and Growth Rate (2017-2022)

    • Figure Global Other Consumption and Growth Rate (2017-2022)

    • Figure Global Fan In Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Fan Out Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Integrated Circuit Fabrication Process Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Semiconductor Industry Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Microelectromechanical Systems (MEMS) Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Other Consumption Forecast and Growth Rate (2022-2028)

    • Table Global Wafer-level Packaging Equipment Import by Region (Top 5 Countries) (2017-2028)

    • Table Global Wafer-level Packaging Equipment Export by Region (Top 5 Countries) (2017-2028)

    • Table Applied Materials (Foundation Year, Company Profile and etc.)

    • Table Applied Materials Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

    • Table Applied Materials Wafer-level Packaging Equipment Product and Service

    • Table Tokyo Electron (Foundation Year, Company Profile and etc.)

    • Table Tokyo Electron Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

    • Table Tokyo Electron Wafer-level Packaging Equipment Product and Service

    • Table KLA-Tencor Corporation (Foundation Year, Company Profile and etc.)

    • Table KLA-Tencor Corporation Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

    • Table KLA-Tencor Corporation Wafer-level Packaging Equipment Product and Service

    • Table EV Group (Foundation Year, Company Profile and etc.)

    • Table EV Group Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

    • Table EV Group Wafer-level Packaging Equipment Product and Service

    • Table Tokyo Seimitsu (Foundation Year, Company Profile and etc.)

    • Table Tokyo Seimitsu Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

    • Table Tokyo Seimitsu Wafer-level Packaging Equipment Product and Service

    • Table Disco (Foundation Year, Company Profile and etc.)

    • Table Disco Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

    • Table Disco Wafer-level Packaging Equipment Product and Service

    • Table SEMES (Foundation Year, Company Profile and etc.)

    • Table SEMES Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

    • Table SEMES Wafer-level Packaging Equipment Product and Service

    • Table Suss Microtec (Foundation Year, Company Profile and etc.)

    • Table Suss Microtec Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

    • Table Suss Microtec Wafer-level Packaging Equipment Product and Service

    • Table Ultratech (Foundation Year, Company Profile and etc.)

    • Table Ultratech Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

    • Table Ultratech Wafer-level Packaging Equipment Product and Service

    • Table Rudolph Technologies (Foundation Year, Company Profile and etc.)

    • Table Rudolph Technologies Wafer-level Packaging Equipment Sales, Price, Value and Gross Profit (2017-2022)

    • Table Rudolph Technologies Wafer-level Packaging Equipment Product and Service


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