New Packages and Materials for Power Devices Market Report

Global and Region New Packages and Materials for Power Devices Market Demand & Opportunity Outlook 2022-2028

  • POSTDATE：Jul 30, 2022
  • PAGES：228
  • REPORT CODE：GMM912927
  • REPORT SUMMARY
  • TABLE OF CONTENTS

  • SIC (silicon carbide) and GaN (gallium nitride) have emerged as the preferred material for making packages for high-intensity semiconductors and power devices. Such materials can support high temperature power circuits and withstand high voltage.

    At the same time the power semiconductor market is undergoing a period of change. Driven by the need for increased power density and system efficiency, wide band gap (WBG) materials such as SiC and gallium nitride (GaN) are being adopted in many applications. These WBG devices require new packages, materials, and assembly methods.

    The report details the trend, potential and market size of New Packages and Materials for Power Devices market, and analyzes the current situation and prospects of the market from both qualitative and quantitative aspects, which can be roughly divided into three parts.

    The first part (Chapter1-7) mainly covers the qualitative analysis of New Packages and Materials for Power Devicesmarket, defines the market attractiveness level of New Packages and Materials for Power Devices market through Porter's Five Forces Analysis, and summarizes the different factors in the overall environment through PEST analysis. Understand the distribution of industrial chain value in each link of industrial chain through the analysis of industrial chain structure. Thus estimate the market space of each link.

    The second part (Chapter8-12), based on the segmentation of New Packages and Materials for Power Devices industry, describes the types of New Packages and Materials for Power Devices market, the applications of major players and the market size, and deeply analyzes the current situation of the global New Packages and Materials for Power Devices market and the development prospects and opportunities of New Packages and Materials for Power Devices industry.

    The third part (Chapter14-15) includes the market positions of the major players and information on the market participants, which will help you gain a comprehensive understanding of the current competitive situation and potential growth opportunities in the market.

    As COVID-19 continues to impact the global economy in 2022, the report also considers the short - and long-term impacts of COVID-19 on the global New Packages and Materials for Power Devices market in Chapter 13.

    By Player:

    • Amkor Technology

    • Littelfuse

    • ON Semiconductor

    • ROHM SEMICONDUCTOR

    • SEMIKRON

    • NXP Semiconductor

    • Remtec, Inc

    • Orient Semiconductor Electronics Ltd

    • MITSUBISHI ELECTRIC CORPORATION

    • Exagan

    • Infineon Technologies AG

    • Efficient Power Conversion Corporation

    • STMicroelectronics

    By Type:

    • Wire Bonding Packaging

    • Gallium Nitrid (GaN)

    • Chip-scale Packaging

    • Gallium Arsenide

    • Silicon Carbide

    • Others

    By End-User:

    • Telecommunications and Computing

    • Industrial

    • Electronics

    • Automotive

    • Others

    By Geography:

    • United States

    • Europe

    • China

    • Japan

    • India

    • South Korea

  • TABLE OF CONTENT

    1 Introduction

    • 1.1 Market Definition

    • 1.2 Market Segment Analysis

    • 1.3 Market Size 2022

    • 1.4 New Packages and Materials for Power Devices Market Outlook: Forecast for 2022 - 2028

    • 1.5 Pricing Analysis

    2 Executive Summary

    3 New Packages and Materials for Power Devices Market Lineage Outlook

    • 3.1 Parent Market Outlook

    • 3.2 Related/Ancillary Market Outlook

    • 3.3 Penetration & Growth Prospect Mapping, 2022

    4 Market Analysis Tools: Porter's Five Forces

    • 4.1 Supplier Power

    • 4.2 Buyer Power

    • 4.3 Substitution Threat

    • 4.4 Threat of New Entrants

    • 4.5 Competitive Rivalry

    5 New Packages and Materials for Power Devices Industry Analysis - PEST (Political & Legal, Economic, Social, and Technological)

    • 5.1 Political/Legal Landscape

    • 5.2 Economic Landscape

    • 5.3 Social Landscape

    • 5.4 Technology Landscape

    6 New Packages and Materials for Power Devices Market - Value Chain Analysis

    • 6.1 Industry's Value Chain Analysis

    • 6.2 Product Life Cycle

    • 6.3 User Perspective Analysis

    7 Region and Country-wise New Packages and Materials for Power Devices Market Analysis and Outlook to 2022

    • 7.1 Global New Packages and Materials for Power Devices Consumption (2017-2022)

    • 7.2 United States New Packages and Materials for Power Devices Consumption (2017-2022)

    • 7.3 Europe New Packages and Materials for Power Devices Consumption (2017-2022)

    • 7.4 China New Packages and Materials for Power Devices Consumption (2017-2022)

    • 7.5 Japan New Packages and Materials for Power Devices Consumption (2017-2022)

    • 7.6 India New Packages and Materials for Power Devices Consumption (2017-2022)

    • 7.7 South Korea New Packages and Materials for Power Devices Consumption (2017-2022)

    8 Region and Country-wise New Packages and Materials for Power Devices Market Analysis and Outlook to 2028

    • 8.1 Global New Packages and Materials for Power Devices Consumption Forecast (2022-2028)

    • 8.2 United States New Packages and Materials for Power Devices Consumption Forecast (2022-2028)

    • 8.3 Europe New Packages and Materials for Power Devices Consumption Forecast (2022-2028)

    • 8.4 China New Packages and Materials for Power Devices Consumption Forecast (2022-2028)

    • 8.5 Japan New Packages and Materials for Power Devices Consumption Forecast (2022-2028)

    • 8.6 India New Packages and Materials for Power Devices Consumption Forecast (2022-2028)

    • 8.7 South Korea New Packages and Materials for Power Devices Consumption Forecast (2022-2028)

    9 Global New Packages and Materials for Power Devices Market Outlook by Types and Applications to 2022

    • 9.1 Global New Packages and Materials for Power Devices Consumption and Growth Rate by Type (2017-2022)

      • 9.1.1 Global Wire Bonding Packaging Consumption and Growth Rate (2017-2022)

      • 9.1.2 Global Gallium Nitrid (GaN) Consumption and Growth Rate (2017-2022)

      • 9.1.3 Global Chip-scale Packaging Consumption and Growth Rate (2017-2022)

      • 9.1.4 Global Gallium Arsenide Consumption and Growth Rate (2017-2022)

      • 9.1.5 Global Silicon Carbide Consumption and Growth Rate (2017-2022)

      • 9.1.6 Global Others Consumption and Growth Rate (2017-2022)

    • 9.2 Global New Packages and Materials for Power Devices Consumption and Growth Rate by Application (2017-2022)

      • 9.2.1 Global Telecommunications and Computing Consumption and Growth Rate (2017-2022)

      • 9.2.2 Global Industrial Consumption and Growth Rate (2017-2022)

      • 9.2.3 Global Electronics Consumption and Growth Rate (2017-2022)

      • 9.2.4 Global Automotive Consumption and Growth Rate (2017-2022)

      • 9.2.5 Global Others Consumption and Growth Rate (2017-2022)

    10 Global New Packages and Materials for Power Devices Market Outlook by Types and Applications to 2028

    • 10.1 Global New Packages and Materials for Power Devices Consumption Forecast and Growth Rate by Type (2022-2028)

      • 10.1.1 Global Wire Bonding Packaging Consumption Forecast and Growth Rate (2022-2028)

      • 10.1.2 Global Gallium Nitrid (GaN) Consumption Forecast and Growth Rate (2022-2028)

      • 10.1.3 Global Chip-scale Packaging Consumption Forecast and Growth Rate (2022-2028)

      • 10.1.4 Global Gallium Arsenide Consumption Forecast and Growth Rate (2022-2028)

      • 10.1.5 Global Silicon Carbide Consumption Forecast and Growth Rate (2022-2028)

      • 10.1.6 Global Others Consumption Forecast and Growth Rate (2022-2028)

    • 10.2 Global New Packages and Materials for Power Devices Consumption Forecast and Growth Rate by Application (2022-2028)

      • 10.2.1 Global Telecommunications and Computing Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.2 Global Industrial Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.3 Global Electronics Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.4 Global Automotive Consumption Forecast and Growth Rate (2022-2028)

      • 10.2.5 Global Others Consumption Forecast and Growth Rate (2022-2028)

    11 Global New Packages and Materials for Power Devices Import and Export Analysis (Top 5 Countries)

    • 11.1 Global New Packages and Materials for Power Devices Import by Region (Top 5 Countries) (2017-2028)

    • 11.2 Global New Packages and Materials for Power Devices Export by Region (Top 5 Countries) (2017-2028)

    12 Coronavirus Disease (COVID-19) Impact

    • 12.1 Industry Impact Analysis

    • 12.2 New Packages and Materials for Power Devices Market Outlook to 2028 - COVID-19 Affected Forecasts

    13 Competition Matrix

    • 13.1 Target Markets

    • 13.2 Comprehensive Analysis of Products in Competitive Markets

    14 Global New Packages and Materials for Power Devices Market Competitive Analysis

    • 14.1 Amkor Technology

      • 14.1.1 Amkor Technology Company Details

      • 14.1.2 Amkor Technology New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.1.3 Amkor Technology New Packages and Materials for Power Devices Product and Service

    • 14.2 Littelfuse

      • 14.2.1 Littelfuse Company Details

      • 14.2.2 Littelfuse New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.2.3 Littelfuse New Packages and Materials for Power Devices Product and Service

    • 14.3 ON Semiconductor

      • 14.3.1 ON Semiconductor Company Details

      • 14.3.2 ON Semiconductor New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.3.3 ON Semiconductor New Packages and Materials for Power Devices Product and Service

    • 14.4 ROHM SEMICONDUCTOR

      • 14.4.1 ROHM SEMICONDUCTOR Company Details

      • 14.4.2 ROHM SEMICONDUCTOR New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.4.3 ROHM SEMICONDUCTOR New Packages and Materials for Power Devices Product and Service

    • 14.5 SEMIKRON

      • 14.5.1 SEMIKRON Company Details

      • 14.5.2 SEMIKRON New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.5.3 SEMIKRON New Packages and Materials for Power Devices Product and Service

    • 14.6 NXP Semiconductor

      • 14.6.1 NXP Semiconductor Company Details

      • 14.6.2 NXP Semiconductor New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.6.3 NXP Semiconductor New Packages and Materials for Power Devices Product and Service

    • 14.7 Remtec, Inc

      • 14.7.1 Remtec, Inc Company Details

      • 14.7.2 Remtec, Inc New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.7.3 Remtec, Inc New Packages and Materials for Power Devices Product and Service

    • 14.8 Orient Semiconductor Electronics Ltd

      • 14.8.1 Orient Semiconductor Electronics Ltd Company Details

      • 14.8.2 Orient Semiconductor Electronics Ltd New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.8.3 Orient Semiconductor Electronics Ltd New Packages and Materials for Power Devices Product and Service

    • 14.9 MITSUBISHI ELECTRIC CORPORATION

      • 14.9.1 MITSUBISHI ELECTRIC CORPORATION Company Details

      • 14.9.2 MITSUBISHI ELECTRIC CORPORATION New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.9.3 MITSUBISHI ELECTRIC CORPORATION New Packages and Materials for Power Devices Product and Service

    • 14.10 Exagan

      • 14.10.1 Exagan Company Details

      • 14.10.2 Exagan New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.10.3 Exagan New Packages and Materials for Power Devices Product and Service

    • 14.11 Infineon Technologies AG

      • 14.11.1 Infineon Technologies AG Company Details

      • 14.11.2 Infineon Technologies AG New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.11.3 Infineon Technologies AG New Packages and Materials for Power Devices Product and Service

    • 14.12 Efficient Power Conversion Corporation

      • 14.12.1 Efficient Power Conversion Corporation Company Details

      • 14.12.2 Efficient Power Conversion Corporation New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.12.3 Efficient Power Conversion Corporation New Packages and Materials for Power Devices Product and Service

    • 14.13 STMicroelectronics

      • 14.13.1 STMicroelectronics Company Details

      • 14.13.2 STMicroelectronics New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

      • 14.13.3 STMicroelectronics New Packages and Materials for Power Devices Product and Service

    15 Appendix


    TABLE OF CHARTS

    • Table Definition of New Packages and Materials for Power Devices

    • Figure New Packages and Materials for Power Devices Picture

    • Table Global New Packages and Materials for Power Devices Market Size and Forecast 2022 - 2028 (USD million)

    • Figure Global New Packages and Materials for Power Devices Market Size and Forecast 2022 - 2028 (USD million)

    • Figure Global New Packages and Materials for Power Devices Market: Year-over-year Growth 2022 - 2028 (%)

    • Table Parent Market Analysis

    • Figure Parent Market Price

    • Table Related/Ancillary Market Outlook Analysis

    • Table Supplier Power Analysis

    • Table Buyer Power Analysis

    • Table Substitution Threat Analysis

    • Table Threat of New Entrants Analysis

    • Table Competitive Rivalry Analysis

    • Figure Global New Packages and Materials for Power Devices Consumption by Country (2017-2022)

    • Figure United States New Packages and Materials for Power Devices Consumption and Growth Rate (2017-2022)

    • Table Europe New Packages and Materials for Power Devices Consumption and Growth Rate (2017-2022)

    • Figure China New Packages and Materials for Power Devices Consumption and Growth Rate (2017-2022)

    • Figure Japan New Packages and Materials for Power Devices Consumption and Growth Rate (2017-2022)

    • Figure India New Packages and Materials for Power Devices Consumption and Growth Rate (2017-2022)

    • Figure South Korea New Packages and Materials for Power Devices Consumption and Growth Rate (2017-2022)

    • Figure Global New Packages and Materials for Power Devices Consumption Forecast by Country (2022-2028)

    • Figure United States New Packages and Materials for Power Devices Consumption Forecast and Growth Rate (2022-2028)

    • Table Europe New Packages and Materials for Power Devices Consumption Forecast and Growth Rate (2022-2028)

    • Figure China New Packages and Materials for Power Devices Consumption Forecast and Growth Rate (2022-2028)

    • Figure Japan New Packages and Materials for Power Devices Consumption Forecast and Growth Rate (2022-2028)

    • Figure India New Packages and Materials for Power Devices Consumption Forecast and Growth Rate (2022-2028)

    • Figure South Korea New Packages and Materials for Power Devices Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Wire Bonding Packaging Consumption and Growth Rate (2017-2022)

    • Figure Global Gallium Nitrid (GaN) Consumption and Growth Rate (2017-2022)

    • Figure Global Chip-scale Packaging Consumption and Growth Rate (2017-2022)

    • Figure Global Gallium Arsenide Consumption and Growth Rate (2017-2022)

    • Figure Global Silicon Carbide Consumption and Growth Rate (2017-2022)

    • Figure Global Others Consumption and Growth Rate (2017-2022)

    • Figure Global Telecommunications and Computing Consumption and Growth Rate (2017-2022)

    • Figure Global Industrial Consumption and Growth Rate (2017-2022)

    • Figure Global Electronics Consumption and Growth Rate (2017-2022)

    • Figure Global Automotive Consumption and Growth Rate (2017-2022)

    • Figure Global Others Consumption and Growth Rate (2017-2022)

    • Figure Global Wire Bonding Packaging Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Gallium Nitrid (GaN) Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Chip-scale Packaging Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Gallium Arsenide Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Silicon Carbide Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Others Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Telecommunications and Computing Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Industrial Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Electronics Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Automotive Consumption Forecast and Growth Rate (2022-2028)

    • Figure Global Others Consumption Forecast and Growth Rate (2022-2028)

    • Table Global New Packages and Materials for Power Devices Import by Region (Top 5 Countries) (2017-2028)

    • Table Global New Packages and Materials for Power Devices Export by Region (Top 5 Countries) (2017-2028)

    • Table Amkor Technology (Foundation Year, Company Profile and etc.)

    • Table Amkor Technology New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table Amkor Technology New Packages and Materials for Power Devices Product and Service

    • Table Littelfuse (Foundation Year, Company Profile and etc.)

    • Table Littelfuse New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table Littelfuse New Packages and Materials for Power Devices Product and Service

    • Table ON Semiconductor (Foundation Year, Company Profile and etc.)

    • Table ON Semiconductor New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table ON Semiconductor New Packages and Materials for Power Devices Product and Service

    • Table ROHM SEMICONDUCTOR (Foundation Year, Company Profile and etc.)

    • Table ROHM SEMICONDUCTOR New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table ROHM SEMICONDUCTOR New Packages and Materials for Power Devices Product and Service

    • Table SEMIKRON (Foundation Year, Company Profile and etc.)

    • Table SEMIKRON New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table SEMIKRON New Packages and Materials for Power Devices Product and Service

    • Table NXP Semiconductor (Foundation Year, Company Profile and etc.)

    • Table NXP Semiconductor New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table NXP Semiconductor New Packages and Materials for Power Devices Product and Service

    • Table Remtec, Inc (Foundation Year, Company Profile and etc.)

    • Table Remtec, Inc New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table Remtec, Inc New Packages and Materials for Power Devices Product and Service

    • Table Orient Semiconductor Electronics Ltd (Foundation Year, Company Profile and etc.)

    • Table Orient Semiconductor Electronics Ltd New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table Orient Semiconductor Electronics Ltd New Packages and Materials for Power Devices Product and Service

    • Table MITSUBISHI ELECTRIC CORPORATION (Foundation Year, Company Profile and etc.)

    • Table MITSUBISHI ELECTRIC CORPORATION New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table MITSUBISHI ELECTRIC CORPORATION New Packages and Materials for Power Devices Product and Service

    • Table Exagan (Foundation Year, Company Profile and etc.)

    • Table Exagan New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table Exagan New Packages and Materials for Power Devices Product and Service

    • Table Infineon Technologies AG (Foundation Year, Company Profile and etc.)

    • Table Infineon Technologies AG New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table Infineon Technologies AG New Packages and Materials for Power Devices Product and Service

    • Table Efficient Power Conversion Corporation (Foundation Year, Company Profile and etc.)

    • Table Efficient Power Conversion Corporation New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table Efficient Power Conversion Corporation New Packages and Materials for Power Devices Product and Service

    • Table STMicroelectronics (Foundation Year, Company Profile and etc.)

    • Table STMicroelectronics New Packages and Materials for Power Devices Sales, Price, Value and Gross Profit (2017-2022)

    • Table STMicroelectronics New Packages and Materials for Power Devices Product and Service


Report Version Choose

Report

BUY NOW

Our Customers

Beyond grateful for the confidence and support from all partners and customers.A win-win situation is our ultimate pursuit.

Beyond Consulting, Future is Feasible

We provide more professional and intelligent market reports to complement your business decisions.

CONTACT US